SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE, AND METHOD FOR PRODUCING EACH

摘要

Disclosed is a semiconductor device having an electrode (bonding pad) wherein a Cu wire bond join is possible having favorable initial bondability and high reliability. Further disclosed are a semiconductor package, and a method for producing each. The semiconductor device is provided with: an active element; an electrode (8) that has aluminum as the primary component and that is electrically connected to the abovementioned active element; and a stress relaxation membrane (6) that is disposed only in the center region of the abovementioned electrode (8) and that has mechanical strength that is at least that of copper. As a result, it is possible to reduce damage to the active element when bonding, and it is possible to favorably join a Cu wire, which is the bonding wire, to the electrode, which is the bonding pad.