APPARATUS FOR JOINING OF OLED SUBSTRATE

摘要

PURPOSE: An organic light emitting diode(OLED) substrate bonding apparatus is provided to pressurize an elastic pressurization member combined in an adsorption member to a second substrate, thereby preventing adsorption failure by minimizing leak generation between the adsorption member and second substrate. CONSTITUTION: A substrate adsorption unit(200) is combined in the lower part of an attaching device main body(100). The substrate adsorption unit comprises an adsorption member(210) and a substrate planarization part. The adsorption member comprises an adsorption surface adsorbing a second substrate. The substrate planarization part flattens the second substrate corresponding to the adsorption surface of the adsorption member. A plurality of substrate holders(231) is simultaneously ascended or descended by a substrate holder operation part.