发明名称 |
CERAMIC ELECTRONIC COMPONENT AND MANUFACTURING METHOD FOR THE SAME |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a highly-reliable ceramic electronic component having a foundation electrode layer formed on a ceramic base body and an external electrode including a Cu plating film formed on the foundation electrode layer. <P>SOLUTION: A ceramic electronic component 1 includes a ceramic base body 10, external electrodes 13 and 14. The external electrodes 13 and 14 are formed on the ceramic base body 10. The external electrodes 13 and 14 have a foundation electrode layer 15 and a first Cu plating film 16. The foundation electrode layer 15 is formed on the ceramic base body 10. The first Cu plating film 16 is formed on the foundation electrode layer 15. The foundation electrode layer 15 includes a metal which can be diffused in Cu and a ceramic binding material. The metal which can be diffused in Cu is diffused in at least a surface layer of the foundation electrode layer 15 in the first Cu plating film 16. <P>COPYRIGHT: (C)2012,JPO&INPIT |
申请公布号 |
JP2012009813(A) |
申请公布日期 |
2012.01.12 |
申请号 |
JP20110036860 |
申请日期 |
2011.02.23 |
申请人 |
MURATA MFG CO LTD |
发明人 |
NISHIZAKA YASUHIRO;SANADA YUKIO;SATO KOJI;MATSUMOTO SEIICHI |
分类号 |
H01G4/252;H01G4/12;H01G4/228;H01G4/30 |
主分类号 |
H01G4/252 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|