发明名称 |
DIELECTRIC RESIN COMPOSITION FOR FILM CAPACITOR AND FILM CAPACITOR |
摘要 |
To increase the heat resistance of a film capacitor, a dielectric resin composition is used as a material for a dielectric resin film used in a film capacitor, the dielectric resin composition being cured by mixing and crosslinking two or more organic materials having functional groups that react with each other to provide a cured article. At least one pair highly cohesive atomic groups which has a molecular cohesive energy equal to or higher than that of a methyl group and capable of cohering with each other due to the molecular cohesive energy is linked to the organic material. The highly cohesive atomic groups form a cohesive portion serving as pseudo-crosslinking. |
申请公布号 |
US2012008250(A1) |
申请公布日期 |
2012.01.12 |
申请号 |
US201113235815 |
申请日期 |
2011.09.19 |
申请人 |
ICHIKAWA TOMOMICHI;HIOKI YASUNORI;YOSHIKAWA NORIHIRO;NAKAMURA ICHIRO;KOBAYASHI SHINICHI;NAKASO ICHIRO;MURATA MANUFACTURING CO., LTD. |
发明人 |
ICHIKAWA TOMOMICHI;HIOKI YASUNORI;YOSHIKAWA NORIHIRO;NAKAMURA ICHIRO;KOBAYASHI SHINICHI;NAKASO ICHIRO |
分类号 |
H01G4/005;C08G18/84 |
主分类号 |
H01G4/005 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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