| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor module having a structure that a content such as a semiconductor chip can be reused even when a surface of a unit is scarred. <P>SOLUTION: The semiconductor module includes components such as a semiconductor chip 11 covered by a thermosetting resin mold 21 for ensuring heat resistance, and the outer edge of the thermosetting resin mold 21 is covered by a thermoplastic resin mold 22. A part of a channel 30 is formed of the thermoplastic resin mold 22, and by laminating units 10 each including components such as the semiconductor chip 11 covered by the thermosetting resin mold 21 and the thermoplastic resin mold 22, a structure with the embedded channel 30 serving as a cooling mechanism is formed. Owing to this structure, when only the thermoplastic resin mold 22 is scarred, the content can be reused by heating the thermoplastic resin mold 22 to soften, removing the thermoplastic resin mold 22, and manufacturing a rebuilt product by using portions other than the thermoplastic resin mold 22. <P>COPYRIGHT: (C)2012,JPO&INPIT |
