| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a fault analysis device which can identify in which manufacturing step of a semiconductor device a cause of fault exists. <P>SOLUTION: The fault analysis device executes the steps of estimating a faulty network where fault occurs based on results of fault diagnoses on a plurality of semiconductor devices of the same design (step S3), obtaining the number of wires in all wiring layers included in the semiconductor device the faulty network uses and calculating a ratio of the number of wires in all wiring layers the faulty network uses (step S5), identifying a network which is probable to use the wiring layer with respect to each wiring layer based on design data of the semiconductor device, obtaining the number of wires the network uses with respect to each wiring layer and calculating a ratio of the number of wires of each wiring layer in all wiring layers (step S12), identifying a ratio of a wiring layer which most closely approximates the ratio calculated in the step S5 among ratios of individual wiring layers calculated in the step S12 (step S6). <P>COPYRIGHT: (C)2012,JPO&INPIT |
