SURFACE-MOUNTED ELECTRONIC COMPONENT

摘要

Disclosed is a surface-mounted electronic component wherein a hollow housing section is reliably sealed in an air-tight manner, and an increase of inner pressure of the hollow housing section is eliminated when heat is applied when reflow soldering and bonding with a conductive adhesive are performed. In the surface-mounted electronic component (1), a resin case (2), metal terminals (4-6), and a sealing metal plate (3) are integrally formed by insertion molding, the hollow housing section (2a) of the resin case (2), and a through hole (2b) that reaches the outer surface of the resin case (2) from the hollow housing section (2a) in the resin case (2) are formed in the resin case (2), and the sealing metal plate (3) seals the through hole (2b). The linear expansion coefficient of the sealing metal plate (3) is set different from that of the resin case (2) such that the sealing metal plate is deformed to stop sealing the through hole (2b) when the sealing metal plate is heated.