| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device manufacturing method which solves the frequently occurring problems of resin unfilled in a tie bar after molding due to a complicated channels formed on a metal mold, which is caused by a shift in a lead frame shape of a product frequently occurring due to cost reduction from a single frame to a matrix frame. <P>SOLUTION: The manufacturing method of the present invention of a semiconductor device using a lead frame provided with a plurality of unit device regions each having a die pad, a plurality of leads disposed around the die pad, tie bars for connecting the plurality of leads and a frame disposed around those elements for supporting the elements comprises the step of monitoring conditions of a resin material (resin body in the tie bar) in a dam surrounding the outer periphery of a resin sealed body after resin molding (e.g. transfer molding) by using a camera under transillumination before cutting the tie bar. <P>COPYRIGHT: (C)2012,JPO&INPIT |
