| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electrical and electronic film-shaped circuit connecting material which is excellent in heat resistance, moisture resistance and workability, and especially required to have severe reliability. <P>SOLUTION: The film-shaped circuit connecting material comprises: an adhesive composition essentially containing (1) a phenoxy resin, (2) a naphthalenediol-based epoxy resin and (3) a latent curing agent; and an electroconductive particle, wherein the content of the naphthalenediol-based epoxy resin is 10 to 70 mass% of the total content of the phenoxy resin and the naphthalenediol-based epoxy resin. <P>COPYRIGHT: (C)2012,JPO&INPIT |
