| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wiring structure that secures excellent connectivity with solder and an electronic component connected to a wiring conductor even if the wiring conductor provided to an outermost layer and solder resist has a relative position shift, and an electronic component package including the wiring structure. <P>SOLUTION: The electronic component package 1 is provided with solder resist 20 having an opening K in a long circular shape at a periphery of a wiring conductor 10. The wiring conductor 10 has lead-out wiring 12, 13 extended linearly from a circular land 11. Further, the opening K of the solder resist 20 is provided such that a major axis C thereof and the wiring 12, 13 contain an angle of 90° (orthogonal). <P>COPYRIGHT: (C)2012,JPO&INPIT |
