| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an improved method of processing a thin flat plate type semiconductor substrate of a solar cell in a known furnace. <P>SOLUTION: The method of processing the solar cell includes the steps of: preparing a vertical furnace 1 so as to receive an array mutually separated circular semiconductor wafers 6 for integrated circuit processing; forming process chamber loading constitution 14 for the solar cell substrates 6, with the size of the solar cell substrates 6 which are present successively along a first surface of an object to be processed being smaller than a corresponding size of the circular semiconductor wafers, so that an array 16 comprising the plurality of solar cell substrates 6 isolated from each other can be housed in a process chamber 10; loading the solar cell substrates 6 in the process chamber 10; and processing the solar cell substrates 6 in the process chamber 10. <P>COPYRIGHT: (C)2012,JPO&INPIT |
