| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor module with a structure provided with cooling fins to improve heat radiation efficiency, which can accurately prevent leakage occurring from a heat spreader and can be prepared for fine fin shapes. <P>SOLUTION: The semiconductor module manufacturing method comprises the steps of forming heat spreaders 13, 14 and cooling fins 18, 19 separately. The heat spreaders 13, 14 are formed of metal plates 13a, 14a, insulation films 13b, 14b and metal films 13c, 14c, and the cooling fins 18, 19 are bonded later. Accordingly, the insulation films 13b, 14b respectively provided in the heat spreaders 13, 14 can prevent occurrence of leakage from the heat spreaders 13, 14. Further, since the cooling fins 18, 19 are formed separately from the heat spreaders 13, 14, the semiconductor module can be prepared for fine fin shapes. <P>COPYRIGHT: (C)2012,JPO&INPIT |
