| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a light-emitting element with reduced manufacturing cost which allows improvement of the environmental resistance and reliability of a light-emitting device with the light-emitting element mounted thereon in comparison to light-emitting devices encapsulated by resin. <P>SOLUTION: The light-emitting element 1 includes: a semiconductor laminated part 20 which emits light when electric current is injected thereinto; and a microcrystal layer 40 which includes microcrystal and emits wavelength conversion light when being excited by light emitted by the semiconductor laminated part 20. The light-emitting element enables the evaluation of white light, screening, etc. on a wafer as it is, and achieves reduction in manufacturing cost. <P>COPYRIGHT: (C)2012,JPO&INPIT |
