| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor module in which the number of power inlet terminals and power outlet terminals, for supplying power supply current stably to a semiconductor chip or reducing noise mixed into a signal system from a power supply, can be decreased and the mounting area of the semiconductor chip can be reduced. <P>SOLUTION: Electrical connection terminals of a power supply system and a signal system are arranged on both sides of a semiconductor chip 20 while being distributed. By a configuration of increasing the allowable current value of a channel through which a large current flows, power can be supplied stably with a small number of terminals, mixing of noise into a signal system is reduced, mounting area is reduced by decreasing the number of pins, heat dissipation effect can be increased, and so forth. Furthermore, stable characteristics can be obtained even in high speed operation where a large current flows by a semiconductor module mounting the semiconductor chip 20. <P>COPYRIGHT: (C)2012,JPO&INPIT |
