| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wiring board excellent in signal transmitting characteristics, and a mounting structure thereof. <P>SOLUTION: The wiring board 3 related to one embodiment of this invention comprises a resin layer 7 and a conductive layer 13 arranged on the resin layer 7. The resin layer 7 has a base material 10, and a resin portion 11 coating the base material 10 and having permittivity lower than the base material 10. The base material 10 is composed of a first fiber bundle 10x made from a plurality of first fibers 10xf having longitudinal directions parallel with each other, and a second fiber bundle 10y made from a plurality of second fibers 10yf having longitudinal directions parallel with each other and intersecting the first fiber bundle 10x. A part of the resin portion 11 is arranged between the first fibers 10xf, between the second fibers 10yf, and between the first fibers 10xf and the second fibers 10yf, and includes a cavity V. The density of the cavity V in an intersecting area C between the first fiber bundle 10x and the second fiber bundle 10y is higher than the density of the cavity V in a non-intersecting area N. <P>COPYRIGHT: (C)2012,JPO&INPIT |
