发明名称 |
INFRARED IMAGING DEVICE AND METHOD OF MANUFACTURING THE SAME |
摘要 |
Certain embodiments provide an infrared imaging device including: an SOI structure that is placed at a distance from a substrate, and includes: heat-sensitive diodes that detect infrared rays and convert the infrared rays into heat; and STI regions that separate the heat-sensitive diodes from one another; an interlayer insulating film that is stacked on the SOI structure; and supporting legs that are connected to the heat-sensitive diodes and vertical signal lines provided in outer peripheral regions of the heat-sensitive diodes. Each of the supporting legs includes: an interconnect unit that transmit signals to the vertical signal lines; and interlayer insulating layers that sandwich the interconnect unit, each bottom side of the interlayer insulating layers being located in a higher position than the SOI structure. |
申请公布号 |
US2012007205(A1) |
申请公布日期 |
2012.01.12 |
申请号 |
US20100883732 |
申请日期 |
2010.09.16 |
申请人 |
SUZUKI KAZUHIRO;FUJIWARA IKUO;SASAKI KEITA;KWON HONAM;YAGI HITOSHI;HONDA HIROTO;ISHII KOICHI;OGATA MASAKO;UENO RISAKO;FUNAKI HIDEYUKI;KABUSHIKI KAISHA TOSHIBA |
发明人 |
SUZUKI KAZUHIRO;FUJIWARA IKUO;SASAKI KEITA;KWON HONAM;YAGI HITOSHI;HONDA HIROTO;ISHII KOICHI;OGATA MASAKO;UENO RISAKO;FUNAKI HIDEYUKI |
分类号 |
H01L31/101;H01L31/18 |
主分类号 |
H01L31/101 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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