发明名称 |
THERMALLY SENSITIVE MATERIAL EMBEDDED IN THE SUBSTRATE |
摘要 |
A structure and methods for using an integrated circuit structure comprise a substrate and circuitry connected to the substrate. The substrate includes a heat sensitive material that changes color when heated. The heat sensitive material has one of a plurality of colors depending upon a temperature to which the substrate was exposed. |
申请公布号 |
US2012007074(A1) |
申请公布日期 |
2012.01.12 |
申请号 |
US20100834110 |
申请日期 |
2010.07.12 |
申请人 |
AYOTTE STEPHEN P.;HOLVERSON KRISTEN L.;SULLIVAN TIMOTHY M.;INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
AYOTTE STEPHEN P.;HOLVERSON KRISTEN L.;SULLIVAN TIMOTHY M. |
分类号 |
H01L23/34;H01L21/66 |
主分类号 |
H01L23/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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