| 摘要 |
<P>PROBLEM TO BE SOLVED: To suppress variations in heat processing temperatures in substrate surfaces and uniformize line widths of wiring patterns in the substrate surface. <P>SOLUTION: The heat processing apparatus comprises: a substrate transportation means 20; a first chamber 8A that covers predetermined sections of a substrate transportation passage 2 and forms a heat processing space for a processed substrate G to which the substrate transportation passage is transported; first means 17, 18 that can heat the inside of the first chamber; second means 41, 42 that can spray an air cooled to a predetermined temperature for the processed substrate to which the substrate transportation passage is transported and can locally cool the processed substrate; substrate detection means 45 for detecting the processed substrate which is provided in a front stage of the first chamber and to which the substrate transportation passage is transported; and control means 40 to which a detection signal of the substrate detection means is supplied and which turns on/off cooling operation performed by the second means. <P>COPYRIGHT: (C)2012,JPO&INPIT |
