| 摘要 |
<P>PROBLEM TO BE SOLVED: To inexpensively and easily provide an IC package markedly excellent in electroconductivity. <P>SOLUTION: The IC package is comprised of an electroconductive resin shaped object constituted by filling a boron solid solution carbon black in which electric resitivity according to JIS K 1469 is 0.10 Ωcm or less and moisture absorbing water content after 15 days at 30°C and 90% RH is 1% or less, constituted by drying boron solid solution carbon black in which electric resistivity according to JIS K 1469 is 0.10 Ωcm or less and the solid solution amount of boron is 0.6 to 3.0 mass% after washing by boiling. The IC package is characterized in that the part contacting with an IC is constituted of the electroconductive shaped object. The IC package is characterized in that the IG package is IC tray. <P>COPYRIGHT: (C)2012,JPO&INPIT |
