发明名称 HEAT RADIATION STRUCTURE OF HEATING UNIT AND AUDIO AMPLIFIER EQUIPPED WITH HEAT RADIATION STRUCTURE
摘要 <P>PROBLEM TO BE SOLVED: To provide a heat radiation structure which is capable of effectively radiating heat from a heat source to an outside through a heat radiation plate, lightweight and easy to be formed. <P>SOLUTION: A heat radiation structure (10) comprises: a metal section (11) which has one surface opposite to a heat source and another surface facing not in a direction toward the heat source; and a heat-conductive resin section (12) which is formed to protrude from the another surface in an outward direction but not toward the heat source and integrally molded with the metal section (11) by an outsert molding or an insert molding. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012009498(A) 申请公布日期 2012.01.12
申请号 JP20100141696 申请日期 2010.06.22
申请人 FUJITSU TEN LTD;SANKO:KK 发明人 HIDAKA NOBORU;MOMOSE TAKEO;OTSUBO TETSUYA
分类号 H05K7/20;H01L23/36;H01L23/373 主分类号 H05K7/20
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