发明名称 |
HEAT RADIATION STRUCTURE OF HEATING UNIT AND AUDIO AMPLIFIER EQUIPPED WITH HEAT RADIATION STRUCTURE |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a heat radiation structure which is capable of effectively radiating heat from a heat source to an outside through a heat radiation plate, lightweight and easy to be formed. <P>SOLUTION: A heat radiation structure (10) comprises: a metal section (11) which has one surface opposite to a heat source and another surface facing not in a direction toward the heat source; and a heat-conductive resin section (12) which is formed to protrude from the another surface in an outward direction but not toward the heat source and integrally molded with the metal section (11) by an outsert molding or an insert molding. <P>COPYRIGHT: (C)2012,JPO&INPIT |
申请公布号 |
JP2012009498(A) |
申请公布日期 |
2012.01.12 |
申请号 |
JP20100141696 |
申请日期 |
2010.06.22 |
申请人 |
FUJITSU TEN LTD;SANKO:KK |
发明人 |
HIDAKA NOBORU;MOMOSE TAKEO;OTSUBO TETSUYA |
分类号 |
H05K7/20;H01L23/36;H01L23/373 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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