发明名称 |
METHODS, DEVICES, AND MATERIALS FOR METALLIZATION |
摘要 |
A method of making an electronic device which in one embodiment comprises providing a substrate, electrolessly depositing a barrier metal at least on portions of the substrate, and using wet chemistry such as electroless deposition to deposit a substantially gold-free wetting layer having solder wettability onto the barrier metal. An electronic device which in one embodiment comprises a metallization stack. The metallization stack comprises a barrier metal deposited electrolessly and a substantially gold-free wetting layer deposited on the barrier metal, and the wetting layer is wettable by solder.
|
申请公布号 |
US2012007239(A1) |
申请公布日期 |
2012.01.12 |
申请号 |
US20100832034 |
申请日期 |
2010.07.07 |
申请人 |
KOLICS ARTUR;LEE WILLIAM T.;REDEKER FRITZ |
发明人 |
KOLICS ARTUR;LEE WILLIAM T.;REDEKER FRITZ |
分类号 |
H01L23/488;H01L21/768 |
主分类号 |
H01L23/488 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|