| 摘要 |
<P>PROBLEM TO BE SOLVED: To further improve the flatness of a wafer adsorption surface of a wafer holder having a plurality of wafer support members and sealing members formed on a holder substrate. <P>SOLUTION: A plurality of wafer support members 6 and sealing members 3, 4 are formed on a holder substrate 2 (b). By cutting or grinding the upper faces 3a, 4a of the sealing members 3, 4, each height of the upper faces 3a, 4a is made smaller than each height of the upper faces 6a of the wafer support members 6 (d). By cutting or grinding the upper faces 6a of the wafer support members 6, each height of the upper faces 6a is made coincident with each height of the upper faces 3a, 4a of the sealing members 3, 4 (f). As such, because the sealing members 3, 4 and the wafer support members 6 are independently processed, the heights of the upper faces 6a of the wafer support members 6 can be coincident with the heights of the upper faces 3a, 4a of the sealing members 3, 4 after the process. Thus, the flatness of the wafer adsorption surface of the wafer holder 1 can be enhanced. <P>COPYRIGHT: (C)2012,JPO&INPIT |
