发明名称 |
DRESSING METHOD, POLISHING METHOD, AND POLISHING DEVICE |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a dressing method accurately flattening a surface of a pad. <P>SOLUTION: The dressing method includes a dressing step. In the dressing step, to a dresser for dressing a pad on which a polished surface of a base plate abuts to chemically and mechanically polish the base pate, dressing control is carried out about each position on the pad surface according to positions in the pad surface and pad surface state information about a surface state of the pad of each position. The pad surface state information is measured on the basis of pressure applied on a predetermined member, when the member is pressed against the pad. <P>COPYRIGHT: (C)2012,JPO&INPIT |
申请公布号 |
JP2012009692(A) |
申请公布日期 |
2012.01.12 |
申请号 |
JP20100145307 |
申请日期 |
2010.06.25 |
申请人 |
TOSHIBA CORP |
发明人 |
KAWASAKI TAKAHIKO;SHIGA TATSUKI |
分类号 |
H01L21/304;B24B37/00;B24B53/00 |
主分类号 |
H01L21/304 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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