发明名称 SUBSTRATE TREATMENT METHOD AND SUBSTRATE TREATMENT APPARATUS
摘要 <P>PROBLEM TO BE SOLVED: To provide a substrate treatment method and a substrate treatment apparatus having a simple constitution in which the surface of a substrate is treated with droplets. <P>SOLUTION: A jig 10 capable of jetting gas from an opening formed along a circular virtual line and a pressure sensor for detecting an internal pressure in the jig 10 are prepared. The jig 10 is held such that droplets attached on the surface of a substrate 5 when viewed from the direction perpendicular to the surface of the substrate 5 are surrounded in the opening. While the gas jetted from the opening is blown onto the surface of the substrate 5, the position of the jig 10 along the direction perpendicular to the surface of the substrate 5 is adjusted so that a differential pressure between the internal pressure and a specific pressure may be minimized. The jig 10 is held such that droplets attached on the surface of the substrate 5 when viewed from the direction perpendicular to the surface of the substrate 5 are surrounded in the opening. While the gas jetted from the opening is blown onto the surface of the substrate, the jig 10 is relatively moved along the surface of the substrate. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012009475(A) 申请公布日期 2012.01.12
申请号 JP20100141292 申请日期 2010.06.22
申请人 NAS GIKEN:KK 发明人 SAKURAI YOSHIO
分类号 H01L21/66;H01L21/306 主分类号 H01L21/66
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