SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To enhance reliability of a PoP package.

SOLUTION: A PoP package 10 comprises a substrate 31, an underfill resin layer 39 provided on the substrate 31, and a semiconductor chip 32 having a main surface 32a and a rear face 32b on the reverse side thereof, and flip-chip mounted on the substrate 31 with the underfill resin layer 39 interposed therebetween while facing the main surface 32a thereto. The semiconductor chip 32 is covered with the underfill resin layer 39 on the main surface 32a and from the main surface 32a to the edge 32c of the rear face 32b.

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