| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide semiconductor film which offers increased pickup capability and prevents occurrence of faults in semiconductor elements making it possible to manufacture highly reliable semiconductor devices, and to provide a semiconductor device manufacturing method using such semiconductor film. <P>SOLUTION: Semiconductor film 10 comprises an adhesive layer 3, a first gluing layer 1, a second gluing layer 2 and support film 4, which are laminated in that order. A semiconductor wafer 7 is laminated on a side of the adhesive layer 3 opposite to the first gluing layer 1. While in this state, the semiconductor wafer 7 and the adhesive layer 3 are cut off and respectively fragmented, and the fragments thus obtained are picked up from the support film 4. In the semiconductor film used that way, the first gluing layer 1 is made from a layer composed of a resin compound containing a base resin, an energy ray hardening resin and an energy ray hardening initiator by hardening the layer by irradiation of energy rays. <P>COPYRIGHT: (C)2012,JPO&INPIT |
