| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a side-emission type LED package, in which moldability of the sealing body is improved, and workability thereof can be improved. <P>SOLUTION: An LED package 100 includes: an LED chip 102; a lower structure including a lower mirror 114 extended upward to the outside around the LED chip to reflect light generated from the LED chip upward while supporting the LED chip, and a transparent sealing body 120 formed around the LED chip inside the lower mirror 114; and an upper structure 130 combined with the upper part of the lower structure to reflect the light reflected upward by the lower structure in a radial lateral direction. As described above, the lower structure for reflecting the light of the LED chip upward and the upper structure for further laterally reflecting the reflected light are separately formed and combined with each other. <P>COPYRIGHT: (C)2012,JPO&INPIT |
