| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device having high heat radiation performance. <P>SOLUTION: A semiconductor device 10 comprises: a semiconductor chip 1; a frame 2 supporting the semiconductor chip 1; an insulator 3 sealing the semiconductor chip 1 and the frame 2; and a heat sink 4 disposed so as to face the frame 2 via the insulator 3. The frame 2 is disposed so as to be parallel with at least a part of both a first surface 4a and a second surface 4b that is adjacent to the first surface 4a and intersects with the first surface 4a. <P>COPYRIGHT: (C)2012,JPO&INPIT |
