Provided is a film formation apparatus capable of reducing vibration and deformation that may be transmitted to an alignment mechanism and thereby suppressing misalignment between a substrate and a mask in a surface direction. The film formation apparatus includes: a film forming chamber; a supporting member; and an alignment mechanism provided on the supporting member in which: the supporting member includes a supporting plate for placing the alignment mechanism, and a leg portion; the supporting plate is provided so as to be spaced apart from a top board of the film forming chamber via the leg portion; and at least a part of the supporting plate is formed of a damping material capable of converting vibration transmitted to the supporting plate into thermal energy, thereby suppressing the vibration.
