发明名称 |
SEMICONDUCTOR CHIP WITH BACKSIDE CONDUCTOR STRUCTURE |
摘要 |
Various semiconductor devices and methods of testing such devices are disclosed. In one aspect, a method of manufacturing is provided that includes forming a bore from a backside of a semiconductor chip through a buried insulating layer and to a semiconductor device layer of the semiconductor chip. A conductor structure is formed in the bore to establish an electrically conductive pathway between the semiconductor device layer and the conductor structure. The conductor structure may provide a diagnostic pathway. |
申请公布号 |
US2012007075(A1) |
申请公布日期 |
2012.01.12 |
申请号 |
US201113239872 |
申请日期 |
2011.09.22 |
申请人 |
WANG LIANG;BRUCE MICHAEL R.;GLOBALFOUNDRIES INC. |
发明人 |
WANG LIANG;BRUCE MICHAEL R. |
分类号 |
H01L23/544 |
主分类号 |
H01L23/544 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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