发明名称 ELECTROLESS PLATING APPARATUS
摘要 PURPOSE: An electroless plating device is provided to prevent the corrosion of the elements inner surface by plating the entire inside surface of the elements having through holes. CONSTITUTION: An electroless plating device comprises a plating solution storing unit(2), first and second connecting members(5,6), a conveying unit(3), and a first temperature control unit(4). The plating solution storing unit having a through hole stores the plating liquid for plating the inner surface of the element. The first concatenated member is connected to one end of the part to be communicated with the through hole. The second connecting member is connected to the other end of the part to be communicated in the through hole. The first temperature control unit controls the temperature of the plating liquid which passes through the through hole in order to plate the inner surface of the elements.
申请公布号 KR20120004116(A) 申请公布日期 2012.01.12
申请号 KR20100064796 申请日期 2010.07.06
申请人 HONG, JEONG PYO 发明人 HONG, JEONG PYO
分类号 C23C18/54;C23C18/00 主分类号 C23C18/54
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