发明名称 COPPER-ZINC ALLOY ELECTROPLATING BATH AND METHOD OF PLATING USING SAME
摘要 <p>Provided is a copper-zinc alloy electroplating bath which can form a copper-zinc alloy plating coating having an improved throwing property and a plating method using the same. Also provided is a copper-zinc alloy electroplating bath containing, as an additive, at least one selected from the group consisting of the compounds represented by the following formulae (I) to (III): €ƒ€ƒ€ƒ€ƒ€ƒ€ƒ€ƒ€ƒR 2 -O-(R 1 -O) n -R 2 €ƒ€ƒ€ƒ€ƒ€ƒ(II) (wherein R 1 represents a lower alkylene group, R 2 represents H or a lower alkyl group, and the weight-average molecular weight is 10 3 to 10 5 ); and €ƒ€ƒ€ƒ€ƒ€ƒ€ƒ€ƒ€ƒNa-SO 3 -(CH 2 ) 3 -S-S(CH 2 ) 3 -SO 3 -Na€ƒ€ƒ€ƒ€ƒ€ƒ(III) These additives can be used alone, and two or more of these can be used in combination.</p>
申请公布号 EP2405034(A1) 申请公布日期 2012.01.11
申请号 EP20100748805 申请日期 2010.03.04
申请人 BRIDGESTONE CORPORATION 发明人 WADA, YUKIKO
分类号 C25D3/58 主分类号 C25D3/58
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