RESIN COMPOSITION FOR WIRING BOARD, RESIN SHEET FOR WIRING BOARD, COMPOSITE BODY, METHOD FOR PRODUCING COMPOSITE BODY, AND SEMICONDUCTOR DEVICE

摘要

Disclosed are a composite body, a method for producing the composite body and a semiconductor device, the composite body comprising a resin layer and a fine wiring and/or via hole being formed in the resin layer, having high adhesion and high reliability, and being capable of high frequencies. Also disclosed are a resin composition and a resin sheet, both of which can provide such a composite body. The composite body comprises a resin layer and an electroconductive layer, wherein a groove having a maximum width of 1 µm or more and 10 µm or less is on a surface of the resin layer; the electroconductive layer is inside the groove; and a surface of the resin layer being in contact with the electroconductive layer has an arithmetic average roughness (Ra) of 0.05 µm or more and 0.45 µm or less, and/or wherein the resin layer has a via hole having a diameter of 1 µm or more and 25 µm or less; the electroconductive layer is inside the via hole; and a surface of the resin layer of the inside of the via hole has an arithmetic average roughness (Ra) of 0.05 µm or more and 0.45 µm or less. The resin composition comprises an inorganic filler and a thermosetting resin, wherein the inorganic filler contains coarse particles having a diameter of more than 2 µm in an amount of 500 ppm or less. The resin sheet comprises a resin layer and a substrate, wherein the resin layer is on the substrate and comprises the resin composition.