COMPOSITION FOR PREPARING THERMOSETTING RESIN, CURED PRODUCT OF THE COMPOSITION, PREPREG AND PREPREG LAMINATE HAVING THE CURED PRODUCT, AND METAL CLAD LAMINATE AND PRINTED CIRCUIT BOARD HAVING THE PREPREG OR THE PREPREG LAMINATE

摘要

PURPOSE: A composition for manufacturing thermosetting resin is provided to obtain a prepreg and a prepreg laminate, which have low thermal expansion ratio, low permittivity, dielectric loss and low moisture absorbency, and to have high glass transition temperature. CONSTITUTION: A composition for manufacturing thermosetting resin comprises 100.0 parts by weight aromatic polyester amide copolymer and 10-900 parts by weight epoxy resin. The aromatic polyester amide copolymer comprises: 10-30 mol% repeating unit, which has at least one terminal group among amino terminal group or hydroxy terminal group, originated from aromatic hydroxy carboxylic acid; 15-25 mol% repeating unit, which has phenolic hydroxy group, originated from aromatic amine or aromatic diamine; 15-25 mol% repeating unit originated from aromatic diol; and 30-60 mol% repeating unit originated from dicarboxylic acid.