| 摘要 |
PURPOSE: A multilayer embedded printed circuit board and a manufacturing method thereof are provided to minimize a power line and a signal line by most closely embedding a bypass cap. CONSTITUTION: A first and second CCL(Copper Clad Laminate)s comprise a core layer(20) and a cavity(30). A part element is installed in the cavity arranged in the first and second CCLs. The part element is an active element(40) or a passive element(50). The active element includes an integrated circuit(IC). The passive element is able to include a capacitor, a register, and an inductor. A circuit layer(60) is able to be arranged in upper and lower surfaces of the first and second CCLs. A pattern antenna layer(70) is able to be arranged on the upper surface of a substrate including the first and second CCLs and circuit layer.
|
