| 摘要 |
<p>Provided is a resin foam which is satisfactorily flexible and electrically conductive, can be easily processed into a desired shape, and is usable as an electrically conductive cushioning sealant capable of filling in a minute clearance between densely packaged electronic components. The resin foam has a volume resistivity of 10 10 ©€¢cm or less and a repulsive load at 50% compression of 5 N/cm 2 or less. The resin foam preferably has a surface resistivity of 10 10 ohms per square or less, preferably has an apparent density of 0.01 to 0.15 g/cm 3 , and preferably has an expansion ratio of 9 times or more.</p> |
