| 摘要 |
A method for assembling light emitting diodes (LEDs) to a ceramic heat conductive member comprises: mixing ceramic materials together and subjecting the mixed ceramic materials to hot pressing to form the ceramic heat conductive member 30, subjecting a surface 301 of the ceramic heat conductive member to a silver printing, drying and silver reduction process to form a patterned silver layer 31 thereon, applying conductive binders 32 to the silver layer by a coating process and attaching the LEDs 14 between paired conductive binders by welding. The structure produced by the method is such that the LEDs are located between the paired conductive binders, and each of the LEDs includes a LED wafer 140 disposed on a substrate 141, so that the heat generated by the LEDs can be transmitted quickly to the ceramic heat conductive member via the conductive binders and the silver layer. |
