发明名称 |
DEVICE FOR TEMPERATURE STABILISATION OF CHIP ASSEMBLY ELEMENTS |
摘要 |
FIELD: electricity. ^ SUBSTANCE: device for temperature stabilisation of chip assembly elements contains conductor; dielectric rectangular substrate with strip film heater located at its operators side along longitudinal axis and the first termination of heater is connected to conductor; two rectangular areas for installation of chip assembly elements limited by substrate edges and four lines applied to this surface, which differ visually from other elements on substrate surface; temperature sensor installed near substrate edge at transversal axis of its working area, temperature-control circuit connected by common conductor, blocking capacitor; at backside of substrate there's metal layer symmetrical to its longitudinal axis, its length is equal to length of substrate and width varies within 1.00-1.05 of distance between lines applied to work side of substrate and the metal layer is connected with common conductor at point located at longitudinal axis of substrate side close to the second termination of heater. ^ EFFECT: functionality enhancement for thermostat devices operating in broad band of frequencies. ^ 11 dwg |
申请公布号 |
RU2439746(C1) |
申请公布日期 |
2012.01.10 |
申请号 |
RU20100122358 |
申请日期 |
2010.06.01 |
申请人 |
GOSUDARSTVENNOE OBRAZOVATEL'NOE UCHREZHDENIE VYSSHEGO PROFESSIONAL'NOGO OBRAZOVANIJA TOMSKIJ GOSUDARSTVENNYJ UNIVERSITET SISTEM UPRAVLENIJA I RADIOEHLEKTRONIKI (TUSUR) |
发明人 |
KOZLOV VITALIJ GRIGOR'EVICH;OZERKIN DENIS VITAL'EVICH;KOZLOVA VALENTINA GRIGOR'EVNA |
分类号 |
H01L23/36 |
主分类号 |
H01L23/36 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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