PURPOSE: A light emitting diode module is provided to efficiently discharge heat generated from a light emitting diode device by connecting a part of the light emitting diode to the surface of a metal substrate through a conductive layer and a lead frame. CONSTITUTION: A first conductive layer is formed in a second region of a metal substrate(11). A second conductive layer is formed on an insulating layer(12a). A first lead frame is formed on the first conductive layer. A second lead frame is formed on the second conductive layer. A light emitting diode device(14) is arranged on the first and second lead frames.
申请公布号
KR20120003193(A)
申请公布日期
2012.01.10
申请号
KR20100063922
申请日期
2010.07.02
申请人
INDUSTRY-ACADEMIC COOPERATION FOUNDATION, YONSEI UNIVERSITY
发明人
KIM, YOUNG JOO;LEE, MOON HO;SHIN, MIN HO;LIM, DONG SOO