发明名称 Semiconductor chip having a reduced band offset in its p-doped region and method for producing the semiconductor chip
摘要 A semiconductor chip (1) comprises a p-doped region (I) having a cladding layer (18) and a contact layer (21) between which a first interlayer (19) and a second interlayer (20) are arranged. A concentration of a first material component (B) within the first and the second interlayer (19, 20) changes in such a way that the band gap varies in a range lying between the band gap of the cladding layer (18) and the band gap of the contact layer (21). A method for producing a semiconductor chip of this type is also disclosed.
申请公布号 US8093579(B2) 申请公布日期 2012.01.10
申请号 US20080154552 申请日期 2008.05.23
申请人 MAYER BERND;SCHMID WOLFGANG;OSRAM OPTO SEMICONDUCTORS GMBH 发明人 MAYER BERND;SCHMID WOLFGANG
分类号 H01L33/00;H01L33/02;H01L33/14;H01L33/30 主分类号 H01L33/00
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