Keypad module of non-backlight panel and panel assembly of the same

摘要

A keypad module includes a non-backlight layer made of an opaque thin sheet, and a key layer made of an ultraviolet curable resin. One surface of the non-backlight layer is provided thereon with a recognition region. The key layer has a base portion and a plurality of pressing portions protruding from the base portion. The base portion is overlapped with and bonded to the surface of the non-backlight layer on which the recognition region is provided. Each of the pressing portions is arranged to correspond to the recognition region. The panel further includes a telecommunication module located below the keypad module.