发明名称 |
Method of making a light emitting device having a molded encapsulant |
摘要 |
Disclosed herein is a method of making a light emitting device having an LED die and a molded encapsulant made by polymerizing at least two polymerizable compositions. The method includes: (a) providing an LED package having an LED die disposed in a reflecting cup, the reflecting cup filled with a first polymerizable composition such that the LED die is encapsulated; (b) providing a mold having a cavity filled with a second polymerizable composition; (c) contacting the first and second polymerizable compositions; (d) polymerizing the first and second polymerizable compositions to form first and second polymerized compositions, respectively, wherein the first and second polymerized compositions are bonded together; and (e) optionally separating the mold from the second polymerized composition. Light emitting devices prepared according to the method are also described.
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申请公布号 |
US8092735(B2) |
申请公布日期 |
2012.01.10 |
申请号 |
US20070834137 |
申请日期 |
2007.08.06 |
申请人 |
THOMPSON D. SCOTT;BOARDMAN LARRY D.;LEATHERDALE CATHERINE A.;3M INNOVATIVE PROPERTIES COMPANY |
发明人 |
THOMPSON D. SCOTT;BOARDMAN LARRY D.;LEATHERDALE CATHERINE A. |
分类号 |
H01L21/56;H01L33/52 |
主分类号 |
H01L21/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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