发明名称 Polishing head and polishing apparatus
摘要 The present invention is a polishing head provided with an annular rigid ring, a rubber film bonded to the rigid ring with a uniform tension, a mid plate joined to the rigid ring and forming a space portion together with the rubber film and the rigid ring, and an annular template provided concentrically with the rigid ring in a peripheral portion on a lower face part of the rubber film and having an outer diameter larger than an inner diameter of the rigid ring, in which a pressure of the space portion can be changed by a pressure adjustment mechanism, a back face of a work is held on the lower face part of the rubber film, and a surface of the work is brought into sliding contact with the polishing pad attached onto a turn table for performing polishing, and an inner diameter of the template is smaller than an inner diameter of the rigid ring, and a ratio between an inner diameter difference between the rigid ring and the template and a difference between the inner diameter and an outer diameter of the template is 26% or more and 45% or less. Thereby, a polishing head and the like that can obtain constant flatness stably can be provided.
申请公布号 US8092281(B2) 申请公布日期 2012.01.10
申请号 US20070311690 申请日期 2007.10.18
申请人 MASUMURA HISASHI;KITAGAWA KOJI;MORITA KOUJI;KISHIDA HIROMI;ARAKAWA SATORU;SHIN-ETSU HANDOTAI CO., LTD.;FUJIKOSHI MACHINERY CORP. 发明人 MASUMURA HISASHI;KITAGAWA KOJI;MORITA KOUJI;KISHIDA HIROMI;ARAKAWA SATORU
分类号 B24B5/35;B24B37/005;B24B37/04;B24B37/30;H01L21/304 主分类号 B24B5/35
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