| 摘要 |
PURPOSE: A lead frame is provided to reduce manufacturing costs by decreasing the thickness of a Pd+Co alloy plating layer without influencing corrosion resistance and reliability. CONSTITUTION: A semiconductor chip is mounted on a chip pad(11). An inner lead(12) and an outer lead(13) connect a semiconductor chip to an external circuit. A dam-bar(15) is formed in a boundary between the inner lead and the outer lead. A lead lock(17) fixes the inner lead. The chip pad, the inner lead, the outer lead and the dam bar include an Ni plating layer, a Pd+Co alloy plating layer, and an Au plating layer.
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