| 摘要 |
In the fabrication of an integrated circuit, a trench with a sidewall is formed along the periphery of the integrated circuit and the substrate is back-lapped to a thickness smaller than the trench depth to separate the integrated circuit from other integrated circuits on the same substrate. Increased protection against contaminant diffusion into the integrated circuit through the sidewall at the periphery is obtained with one or more protective layers. The substrate area useful for integrated circuit fabrication is also increased. |
