发明名称 |
Module with silicon-based layer |
摘要 |
The invention concerns a module comprising a carrier element, a semiconductor device mounted on said carrier element and a silicon-based insulating layer. The silicon-based insulating layer is arranged on the side of the carrier element opposite to the semiconductor device. The invention further concerns a module comprising a semiconductor device, a mold compound at least partly covering the semiconductor device and a silicon-based passivation layer. The silicon-based passivation layer covers at least partly the periphery of the mold compound.
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申请公布号 |
US8093713(B2) |
申请公布日期 |
2012.01.10 |
申请号 |
US20070673303 |
申请日期 |
2007.02.09 |
申请人 |
OTREMBA RALF;SCHLOEGEL XAVER;SCHILZ CHRISTOF MATTHIAS;INFINEON TECHNOLOGIES AG |
发明人 |
OTREMBA RALF;SCHLOEGEL XAVER;SCHILZ CHRISTOF MATTHIAS |
分类号 |
H01L23/10;H01L23/34 |
主分类号 |
H01L23/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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