发明名称 Electrically conductive interconnect system and method
摘要 An electrically conductive interconnect system has a post, extending above a supporting surface, the post including a rigid material, a coating on the rigid material, wherein the post has a first width at the supporting surface and a second width at a distance removed from the supporting surface, and the post narrows from the first width to the second width. A method of electrically connecting a portion of a first supporting surface to a portion of a second supporting surface involves bringing a post on the first supporting surface into contact with an electrically conductive material located on the second supporting surface, softening the electrically conductive material, causing a separation distance between the first supporting surface and the second supporting distance to decrease so that a portion of the post will be surrounded by the electrically conductive material, and allowing the temperature of the electrically conductive material to decrease.
申请公布号 US8093729(B2) 申请公布日期 2012.01.10
申请号 US20070778461 申请日期 2007.07.16
申请人 CUFER ASSET LTD. L.L.C. 发明人 TREZZA JOHN
分类号 H01L23/52 主分类号 H01L23/52
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