发明名称 Method of fabricating a semiconductor device
摘要 According to one embodiment, a method of fabricating a semiconductor device is disclosed. The method can include forming an amorphous layer on a portion of a first silicon substrate having a first plane orientation, and irradiating with micro wave on the amorphous layer to transform from the amorphous layer into a crystalline layer having the first plane orientation.
申请公布号 US8093141(B2) 申请公布日期 2012.01.10
申请号 US20100878780 申请日期 2010.09.09
申请人 AOYAMA TOMONORI;MIYANO KIYOTAKA;KABUSHIKI KAISHA TOSHIBA 发明人 AOYAMA TOMONORI;MIYANO KIYOTAKA
分类号 H01L21/00 主分类号 H01L21/00
代理机构 代理人
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