| 摘要 |
PURPOSE: An inspection and replacing apparatus of a semiconductor package packed in a carrier tape is provided to automatically perform a series of processes including carrier tape inspection and replacement processes in an intensive space, thereby improving reliability of an inspected product and work efficiency. CONSTITUTION: A transport part(100) transfers a first carrier tape and a second carrier tape through first and second rails which are uniformly arranged. A sheet separation part(200) separates a cover sheet from the transferred first and second carrier tapes. A detection part(300) detects a faulty semiconductor package among the transferred first carrier tapes. An elimination part(400) eliminates the faulty semiconductor package detected from a pocket of the first carrier tape. A finish part(600) attaches the cover sheet on the first carrier tape.
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