| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a mounting body capable of down-sizing a whole size, improving performance at a cost lower than a conventional one, and also rapidly responding to products of many kinds in small quantities and products of many kinds in small lot production amount, and to provide a manufacturing method therefor. <P>SOLUTION: The mounting body includes: a mounting chip 11<SB POS="POST">ij</SB>; function element chips 21, 31 and 41 which are embedded inside a chip accommodating recess part provided on a top face side of the mounting chip 11<SB POS="POST">ij</SB>so that top faces of the function element chips become the same level as the top face of the mounting chip 11<SB POS="POST">ij</SB>; an insulation film 111 for wiring on the top face side which includes the top faces of the function element chips 21, 31 and 41, and is provided on the top face of the mounting chip 11<SB POS="POST">ij</SB>; and mounting wiring 57, 56, 52, 53 and 58 on the top face side which are arranged on the insulation film 111 for wiring on the top face side, and are electrically connected to the function element chips 21, 31 and 41. <P>COPYRIGHT: (C)2012,JPO&INPIT |
